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2026 9th International Conference on Materials Design and Applications (ICMDA 2026)

17–20 April 2026 Japan £600

About this event

Full Name: 2026 9th International Conference on Materials Design and Applications (ICMDA 2026)
Abbreviation: ICMDA 2026
Conference Venue: Tohoku University, Sendai, Japan
Conference Date: April 17-20, 2026
Conference Website: www.icmda.org

ICMDA focus on fundamental research and application areas in the field of the design and application of engineering materials, predominantly within the context of mechanical engineering applications.

Publication:
  Accepted and registered papers with presentation will be published in below listed journals of Scientific.Net collection.

  Defect and Diffusion Forum (DDF) (ISSN print 1012-0386 / ISSN web 1662-9507)
  Solid State Phenomena (SSP) (ISSN print 1012-0394 / ISSN web 1662-9779)
  Materials Science Forum (MSF) (ISSN print 0255-5476 / ISSN web 1662-9752)
  Key Engineering Materials (KEM) (ISSN print 1013-9826 / ISSN web 1662-9795)

  Papers will be sent for indexing by Scopus, Inspec, Chemical Abstracts Service, Google Scholar etc.

History: 
   ICMDA 2024: Vol. 1128. Materials Science Forum-ISBN: 978-3-0364-0681-7-Online Linkage | Indexed by Scopus
   ICMDA 2023: Vol. 1099. Materials Science Forum-ISBN: 978-3-0364-0438-7-Online Linkage | Indexed by Scopus  
   ICMDA 2022: Vol. 931. Key Engineering Materials-ISBN: 978-3-0357-2847-7-Online Linkage | Indexed by Scopus
   ICMDA 2021: Vol. 324. Solid State Phenomena-ISBN: 978-3-0357-1859-1-Online Linkage | Indexed by Ei Compendex & Scopus
   ICMDA 2020: Vol. 1009, Materials Science Forum-ISBN: 978-3-0357-1688-7-Online Linkage | Indexed by Ei Compendex & Scopus
   ICMDA 2019: Vol. 972, Materials Science Forum-ISBN: 978-3-0357-1530-9-Online Linkage | Indexed by Ei Compendex & Scopus
   ICMDA 2018: Vol. 937, Materials Science Forum-ISBN: 978-3-0357-1377-0-Online Linkage | Indexed by Ei Compendex & Scopus

Conference Committee
  Conference Chairs:
  Osamu Tabata, Kyoto University of Advanced Science, Japan
  Takashige Omatsu, Chiba University, Japan

  Program Chairs:
  Masahiro Nomura, The University of Tokyo, Japan
  Kwang Leong Choy, Duke Kunshan University, China

  Program Co-Chairs:
  Yoshio Kobayashi, Ibaraki University, Japan
  Anatoly Zinchenko, Nagoya University, Japan
......
More info about conference Committees: https://icmda.org/com.html

Submission Method: 
  System Submission: https://confsys.iconf.org/submission/icmda2026
  Email Submission: [email protected]
  For more details, you can learn through: https://icmda.org/sub.html

Call for Paper: 
  -Materials Properties, Measuring Methods and Applications
   Creep-resistance
   Fracture Mechanics
   Mechanical Propertie

  -Materials Analyses and Modeling
   Electron Microscopy
   Artificial Intelligence Methods
   Computational Material Science

  -Materials Science and Materials Processing Technology
   Optical / Electrical / Magnetic Materials
   Environmental-Friendly Materials
   Surface Engineering / Coatings Technology

  For more topics, please visit: http://www.icmda.org/cfp.html

Contact Us:
  Conference Secretary: Ms. Lynn
  Tel:  +852-3155-4897/+86-28-87577778
  Working Time: Monday - Friday; 9:30-18:00 (UTC/GMT+08:00)

Date and time

Friday, 17 April 2026 until Monday, 20 April 2026

Location

Address

Sendai
Japan
£600
≈ US$802 (estimate)
Per attendee
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  • When 17–20 April 2026
  • Where Japan